Scope
The high data rate communications as well as remote sensing systems demand advanced materials and technology for efficient use of the entire electromagnetic spectrum. This section aims to present the recent advances and future trends in the field of electronic materials and devices for RF, microwave, millimeter-wave, and terahertz applications. A broad range of related topics, from synthesis and properties of the electronic materials to passive components, active devices, circuits and subsystems will be addressed.
Topics
Topics of interest for submission include, but are not limited to:
Section Organizers
Liviu NEDELCU, National Institute of Material Physics, Romania
Aurelian CRUNTEANU, X-LIM Institute, University of Limoges, France
Masahiko TANI, University of Fukui, Japan
Invited papers
Pierre Blondy | Integration of millimeter-wave components using micro additive fabrication |
Mircea Dragoman | Beyond Moore law: electron devices based on atomically thin materials |
Catalin-Daniel Goldner-Constantinescu | Identifying the fundamental mechanisms |
Maryline Guilloux-Viry | Ferroelectric oxide thin films for microwave reconfigurable devices: a focus on growth characterization and integration of thin films in the (K,Na) - (Ta,Nb) - O system |
Hiroaki Minamide | Terahertz-wave technology based on nonlinear optics |
Nathan Newman | Identifying the fundamental mechanisms that limit the performance of modern microwave ceramic dielectrics |
Masahiko Tani | Non-collinear electro-optic sampling techniques for terahertz wave detection |
![]() |
---|